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2 versions: 1st is for partitioning Partitionmanager 188.8.131.52., DOS and BIOS. 0.0.0.1, IOS, Bootloader repair tool ( bootloader. free download free download mega.A. Field of the Invention
The present invention relates to heat transfer surfaces for use in thermal contact with a moving medium. In particular, the present invention relates to a lubricant-impregnated heat transfer surface which permits the thermal transfer of heat from a heat source to the moving medium without the generation of adhesive particulate matter and thereby causes a decrease in the effective coefficient of friction of the heat transfer surface.
B. Description of the Related Art
In general, heat transfer surfaces which receive heat energy from a heat source and transfer this heat energy to a moving medium are used in numerous applications. Typically, heat transfer surfaces are formed of relatively rigid materials and are configured to facilitate the conduction of heat energy to the moving medium. A good example of such a heat transfer surface is the metal surface of a radiator, which is formed of sheets of thin metal which conduct heat to the atmosphere by conduction. In a similar manner, a heat sink is typically formed of a relatively large metal structure, which conducts heat from a heat source to a moving medium by conduction through the heat sink.
A variety of materials are known to be suitable for the manufacture of heat sinks and radiators, such as, for example, cast and wrought metals, such as copper, aluminum, tin-lead, etc. and, in particular, copper. Such heat sinks and radiators may be used to dissipate heat energy from electronic devices, such as computers, semiconductor devices, power supplies, etc., to the surrounding atmosphere, thereby reducing the power consumption of the electronic device.
The size and shape of the heat source and heat sink, and the speed of movement of the moving medium relative to the heat source and heat sink, can vary widely depending upon the type of application in which the heat sink and heat source are being used. In some applications, the heat energy from a heat source